Assuring IoT Device Robustness Through HIL Testing

by Team Declaration | Mar 20, 2023 | Article

Reproduced here with the kind permission of the Editor, New Electronics. Please click here to view pdf of the article. Please click here to view the article online at New Electronics.    

Confidence through simulated hardware-in-the-loop

by Team Declaration | Feb 26, 2023 | Article

Reproduced here with the kind permission of the Editor, Electronic Product Design and Test. Please click here for pdf of article or visit Electronic Product Design and Test

Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs

by Team Declaration | Feb 6, 2023 | Press Release

Henderson, NV – February 6, 2023 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has updated its popular linting tool ALINT-PRO to enhance the support of Microchip Technology’s Libero® SoC Design...

Steatite Uses Wire Bonder on Custom Battery Packs

by Team Declaration | Jan 24, 2023 | Press Release

Asterion EV Wire Bonder Enables Steatite to Reduce Time Taken to Make Electrical Interconnects in Custom Battery Packs by up to 50% Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke &...

How Healthmatic Benefits from Hardware-in-the-Loop

by Team Declaration | Dec 27, 2022 | Article

For OEMs to compete in global markets, product quality is of paramount importance. Products must be reliable and function as intended in all countries in which they are to be sold. To this end, many mid-price, high-volume products for commercial applications — IoT...