by Team Declaration | May 11, 2021 | Press Release
Two Rapid™ Pro Wire Bonders Help Filtronic Meet a Significant Increase in Demand for RF Modules for 5G Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied two Kulicke & Soffa RAPID™ Pro automatic wire bonders...
by Team Declaration | May 10, 2021 | Article
View this article as a pdf In readiness for the EU’s likely ban of chip encapsulation adhesives containing substances of very high concern, DELO’s chemists have produced alternatives that are not only SVHC-free but are also better suited to assuring high reliability....
by Team Declaration | Apr 14, 2021 | Article
View this article as a pdf The reliability of battery pack and power modules used in electric vehicles depends largely on the performance and integrity of hundreds of wire bonds. Richard Warrilow explores the challenges and solutions. The global electric vehicle (EV)...
by Team Declaration | Mar 8, 2021 | Press Release
Inseto is the first distributor serving the UK and Ireland to supply chip encapsulation adhesives for high reliability applications that are free of substances of very high concern (SVHC). Easy and trustworthy access to SVHC-free adhesives made in the EU will become...
by Team Declaration | Mar 4, 2021 | Press Release
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has added more than 60 new HDL rules to ALINT-PRO™’s DO-254 rules plug-in and has made several enhancements to the tool’s Design Entry capabilities to...
