Assuring EV Battery Pack Reliability at the Cell Interconnect Level

by Team Declaration | Apr 22, 2023 | Article

John Govier, Sales Director, and Jim Rhodes, Technical Sales Director, of Inseto explain and compare the two most popular cell interconnect methods. Electromobility (e-mobility), the move away from using internal combustion engines in cars, bikes, buses and trucks...

BPC Electronics Invests in Wire Bonder to Better Serve e-Mobility and Energy Storage Sectors

by Team Declaration | Apr 20, 2023 | Press Release

Battery Tech Expo 2023, Silverstone, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke & Soffa (K&S) Asterion EV wedge bonder at Leicester-based BPC Electronics to support its expansion...

Assuring IoT Device Robustness Through HIL Testing

by Team Declaration | Mar 20, 2023 | Article

Reproduced here with the kind permission of the Editor, New Electronics. Please click here to view pdf of the article. Please click here to view the article online at New Electronics.    

Confidence through simulated hardware-in-the-loop

by Team Declaration | Feb 26, 2023 | Article

Reproduced here with the kind permission of the Editor, Electronic Product Design and Test. Please click here for pdf of article or visit Electronic Product Design and Test

Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs

by Team Declaration | Feb 6, 2023 | Press Release

Henderson, NV – February 6, 2023 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has updated its popular linting tool ALINT-PRO to enhance the support of Microchip Technology’s Libero® SoC Design...