BPC Electronics Invests in Wire Bonder to Better Serve e-Mobility and Energy Storage Sectors

by Team Declaration | Apr 20, 2023 | Press Release

Battery Tech Expo 2023, Silverstone, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke & Soffa (K&S) Asterion EV wedge bonder at Leicester-based BPC Electronics to support its expansion...

Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs

by Team Declaration | Feb 6, 2023 | Press Release

Henderson, NV – February 6, 2023 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has updated its popular linting tool ALINT-PRO to enhance the support of Microchip Technology’s Libero® SoC Design...

Steatite Uses Wire Bonder on Custom Battery Packs

by Team Declaration | Jan 24, 2023 | Press Release

Asterion EV Wire Bonder Enables Steatite to Reduce Time Taken to Make Electrical Interconnects in Custom Battery Packs by up to 50% Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke &...

Introducing BELIeVE – Industry’s First Independent JavaScript-Based Automated Solution for Hardware / Software Integration Verification

by Team Declaration | Oct 19, 2022 | Press Release

Introducing BELIeVE – Industry’s First Independent JavaScript-Based Automated Solution for Hardware / Software Integration Verification London, United Kingdom – Bermondsey Electronics, an embedded systems design and test house, has launched the Bermondsey...

The UK Battery Industrialisation Centre Offers and Develops Wirebonding Using Asterion Wedge Bonder

by Team Declaration | Jun 29, 2022 | Press Release

Battery Cells & Systems Expo, NEC, Birmingham, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke & Soffa (K&S) Asterion EV hybrid wedge bonder at the UK Battery Industrialisation...

Riviera-PRO Supports OpenCPI for Heterogeneous Embedded Computing of Mission-Critical Applications

by Team Declaration | Jun 1, 2022 | Press Release

Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and SoC designs, is supporting Open Component Portability Infrastructure (OpenCPI) with the latest release of Riviera-PRO (release version 2022.04). OpenCPI is an...