by Team Declaration | Jul 19, 2021 | Press Release
Henderson, NV, USA – July 19, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the HES-VU19PD-ZU7EV, an ASIC/SoC physical prototyping and hardware emulation board that can...
by Team Declaration | Jul 7, 2021 | Press Release
TySOM-M-MPFS250 is Aldec’s First Embedded Prototyping Platform Family Member to Feature a PolarFire® SoC FPGA Henderson, NV – July 7, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has...
by Team Declaration | Jun 2, 2021 | Press Release
Aldec Launches HES-DVM Proto ‘Cloud Edition’ – Giving Engineers Easier Access to FPGA-based ASIC & SoC Prototyping Henderson, NV, USA – June 2, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and...
by Team Declaration | May 18, 2021 | Press Release
Henderson, NV – May 18, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, provides industry’s most comprehensive implementation of VHDL 2019 for both Windows and Linux platforms with the latest...
by Team Declaration | May 11, 2021 | Press Release
Two Rapid™ Pro Wire Bonders Help Filtronic Meet a Significant Increase in Demand for RF Modules for 5G Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied two Kulicke & Soffa RAPID™ Pro automatic wire bonders...
by Team Declaration | Mar 8, 2021 | Press Release
Inseto is the first distributor serving the UK and Ireland to supply chip encapsulation adhesives for high reliability applications that are free of substances of very high concern (SVHC). Easy and trustworthy access to SVHC-free adhesives made in the EU will become...