by Team Declaration | Jun 2, 2021 | Press Release
Aldec Launches HES-DVM Proto ‘Cloud Edition’ – Giving Engineers Easier Access to FPGA-based ASIC & SoC Prototyping Henderson, NV, USA – June 2, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and...
by Team Declaration | May 18, 2021 | Press Release
Henderson, NV – May 18, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, provides industry’s most comprehensive implementation of VHDL 2019 for both Windows and Linux platforms with the latest...
by Team Declaration | May 11, 2021 | Press Release
Two Rapid™ Pro Wire Bonders Help Filtronic Meet a Significant Increase in Demand for RF Modules for 5G Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied two Kulicke & Soffa RAPID™ Pro automatic wire bonders...
by Team Declaration | Mar 8, 2021 | Press Release
Inseto is the first distributor serving the UK and Ireland to supply chip encapsulation adhesives for high reliability applications that are free of substances of very high concern (SVHC). Easy and trustworthy access to SVHC-free adhesives made in the EU will become...
by Team Declaration | Mar 4, 2021 | Press Release
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has added more than 60 new HDL rules to ALINT-PRO™’s DO-254 rules plug-in and has made several enhancements to the tool’s Design Entry capabilities to...
by Team Declaration | Mar 1, 2021 | Press Release
Inseto, a leading technical distributor of equipment and materials, has supplied Custom Interconnect Limited (CIL) with a Kulicke & Soffa Asterion large diameter wire / ribbon wedge bonder for use in the production of wide bandgap (WBG) semiconductor-based power...
