Press Releases Archive
Here are examples of press releases written on behalf of clients subscribed to either our Communications or our Campaign Management service, both of which include Content Creation.
The following press releases are presented in reverse chronological order as they were distributed.
Click on any of the following examples to see the full press releases and, importantly, an indication of where they appeared in print and online.
SCSIFlash-Fast™: Protecting and Enhancing Legacy Computing Systems
Southern Manufacturing & Electronics, Farnborough, United Kingdom – Solid State Disks Ltd. (SSDL), a leading manufacturer of solid-state-drives (SSDs) and a value-added reseller (VAR) of latest-technology Flash and DRAM solutions, has launched SCSIFlash-Fast™, a...
Riviera-PRO Supports System Simulation of AMD® Versal™ ACAP Designs
Henderson, NV – June 14, 2023 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and SoC designs, has unveiled the latest release of Riviera-PRO, providing support for system simulation of Versal™ Adaptive Compute...
BPC Electronics Invests in Wire Bonder to Better Serve e-Mobility and Energy Storage Sectors
Battery Tech Expo 2023, Silverstone, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke & Soffa (K&S) Asterion EV wedge bonder at Leicester-based BPC Electronics to support its expansion...
Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs
Henderson, NV – February 6, 2023 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has updated its popular linting tool ALINT-PRO to enhance the support of Microchip Technology’s Libero® SoC Design...
Steatite Uses Wire Bonder on Custom Battery Packs
Asterion EV Wire Bonder Enables Steatite to Reduce Time Taken to Make Electrical Interconnects in Custom Battery Packs by up to 50% Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke &...
Introducing BELIeVE – Industry’s First Independent JavaScript-Based Automated Solution for Hardware / Software Integration Verification
Introducing BELIeVE - Industry’s First Independent JavaScript-Based Automated Solution for Hardware / Software Integration Verification London, United Kingdom – Bermondsey Electronics, an embedded systems design and test house, has launched the Bermondsey Electronics...
The UK Battery Industrialisation Centre Offers and Develops Wirebonding Using Asterion Wedge Bonder
Battery Cells & Systems Expo, NEC, Birmingham, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke & Soffa (K&S) Asterion EV hybrid wedge bonder at the UK Battery Industrialisation...
Riviera-PRO Supports OpenCPI for Heterogeneous Embedded Computing of Mission-Critical Applications
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and SoC designs, is supporting Open Component Portability Infrastructure (OpenCPI) with the latest release of Riviera-PRO (release version 2022.04). OpenCPI is an...
We do NOT use press release distribution services, the ‘wire’ or tools like MailChimp. Press release distribution is managed through our Declaration Media Communications Database, which was designed, built and is maintained in-house. It contains the contact details of thousands of trade press editors, journalists, reporters and freelance. EVERY contact is cross-referenced against one or more of the sectors in which our clients operate. For any given press release we simply select the sectors to which it relates, and the database automatically produces our distribution list. We can also cross-reference the list with forward features lists to identify which topics are on editors’ minds at that point in time. This allows to customise our outgoing emails on an individual basis.
The Declaration Media Communications Database is unique.
No other agency makes data-driven communications in the same way we do.
DER-IC Takes Delivery of First Micro-Punch Sinter Press in the UK
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied Driving the Electric Revolution Industrialisation Centre (DER-IC) North East with equipment to enhance its power electronics, machines and drives (PEMD)...
Aldec Adds UVM Generator to Riviera-PRO™
Productivity Through Methodology: Aldec Adds UVM Generator to Riviera-PRO™ Plus Updates Its OSVVM and UVVM Libraries Henderson, NV – November 16, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA, ASIC and SoC...
Inseto Invests in Wedge Bonder for its Process Development Laboratory
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has invested in a Kulicke & Soffa (K&S) Asterion wedge bonder. Located in Inseto’s Process Development Laboratory along with materials test and plasma cleaning...
Logic-X launches industry’s first 4-in-4-out, 16-bit high-speed ADC/DAC FMC with LVDS digital interfaces
Interface with the Analog World… at Speed Logic-X launches industry’s first 4-in-4-out, 16-bit high-speed ADC/DAC FMC with LVDS digital interfaces Alphen a/d Rijn, Netherlands – September 7, 2021. Logic-X, a developer and supplier of adaptable compute acceleration...
New HES Board is Ideal for Prototyping and Emulating Medium to Large ASIC & SoC Designs
Henderson, NV, USA – July 19, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the HES-VU19PD-ZU7EV, an ASIC/SoC physical prototyping and hardware emulation board that can...
New TySOM-M Series Targets Low Power, High Security Applications
TySOM-M-MPFS250 is Aldec’s First Embedded Prototyping Platform Family Member to Feature a PolarFire® SoC FPGA Henderson, NV – July 7, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has...
Aldec Launches HES-DVM Proto ‘Cloud Edition’
Aldec Launches HES-DVM Proto ‘Cloud Edition’ - Giving Engineers Easier Access to FPGA-based ASIC & SoC Prototyping Henderson, NV, USA – June 2, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC...
Riviera-PRO™ Enables VHDL-2019 Users to Unleash the Power of the Language’s New Additions
Henderson, NV – May 18, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, provides industry’s most comprehensive implementation of VHDL 2019 for both Windows and Linux platforms with the latest...
Wire Bonders Supplied by Inseto Help Filtronic Meet a Significant Increase in Demand for RF Modules for 5G
Two Rapid™ Pro Wire Bonders Help Filtronic Meet a Significant Increase in Demand for RF Modules for 5G Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied two Kulicke & Soffa RAPID™ Pro automatic wire bonders...
Inseto to Supply SVHC-free Chip Encapsulation Adhesives for High Reliability Electronics Assembly Applications
Inseto is the first distributor serving the UK and Ireland to supply chip encapsulation adhesives for high reliability applications that are free of substances of very high concern (SVHC). Easy and trustworthy access to SVHC-free adhesives made in the EU will become...
Airborne System Design Assurance: Aldec Adds 60+ New HDL Rules to ALINT-PRO’s DO-254 Plug-In
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has added more than 60 new HDL rules to ALINT-PRO™’s DO-254 rules plug-in and has made several enhancements to the tool’s Design Entry capabilities to...
Asterion Wedge Bonder Meets CIL’s Advanced Technology Group’s Requirements for Multiple Electric Vehicle Projects
Inseto, a leading technical distributor of equipment and materials, has supplied Custom Interconnect Limited (CIL) with a Kulicke & Soffa Asterion large diameter wire / ribbon wedge bonder for use in the production of wide bandgap (WBG) semiconductor-based power...
Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
Aldec’s Active-HDL™ enables FPGA designers to take full advantage of the many features within the latest revision to VHDL and helps improve design verification efficiency. Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for...
Riviera-PRO™: OSVVM 2020.08 inclusion, enhanced language support, and new debugging features aim to boost productivity
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has updated Riviera-PRO™ to include the 2020.08 revision of the open-source VHDL verification methodology (OSVVM). This gives users of Aldec’s popular...
Users of CSA Catapult’s Facilities and Services Benefit from New Prospector™ Micro Materials Tester
Inseto, a leading technical distributor of equipment and materials, has supplied Compound Semiconductor Applications (CSA) Catapult with a Nordson DAGE Prospector micro-mechanical test station. Located in CSA’s Advanced Packaging laboratory, the tester is being used...
Aldec’s TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq)
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has added PYNQ Python Productivity for Zynq from Xilinx, Inc. to its TySOM family of Xilinx Zynq SoC based boards and its TySOM Embedded Development...
Please note, these examples are all post 2018. We have much older examples, going back two decades, so if you are interested in knowing if we have written a press release about a particular subject matter, please contact us.