by Team Declaration | Jun 2, 2021 | Press Release
Aldec Launches HES-DVM Proto ‘Cloud Edition’ – Giving Engineers Easier Access to FPGA-based ASIC & SoC Prototyping Henderson, NV, USA – June 2, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and...
by Team Declaration | May 31, 2021 | Article
View this article as a pdf NVM is used in most embedded systems, but with different memory types available which is best to use and why? Michael Barrett, Managing Director of Nexus Industrial Memory, provides a brief refresher course and touches on removable...
by Team Declaration | May 18, 2021 | Press Release
Henderson, NV – May 18, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, provides industry’s most comprehensive implementation of VHDL 2019 for both Windows and Linux platforms with the latest...
by Team Declaration | May 11, 2021 | Press Release
Two Rapid™ Pro Wire Bonders Help Filtronic Meet a Significant Increase in Demand for RF Modules for 5G Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied two Kulicke & Soffa RAPID™ Pro automatic wire bonders...
by Team Declaration | May 10, 2021 | Article
View this article as a pdf In readiness for the EU’s likely ban of chip encapsulation adhesives containing substances of very high concern, DELO’s chemists have produced alternatives that are not only SVHC-free but are also better suited to assuring high reliability....
