by Team Declaration | May 10, 2021 | Article
View this article as a pdf In readiness for the EU’s likely ban of chip encapsulation adhesives containing substances of very high concern, DELO’s chemists have produced alternatives that are not only SVHC-free but are also better suited to assuring high reliability....
by Team Declaration | Apr 14, 2021 | Article
View this article as a pdf The reliability of battery pack and power modules used in electric vehicles depends largely on the performance and integrity of hundreds of wire bonds. Richard Warrilow explores the challenges and solutions. The global electric vehicle (EV)...
by Team Declaration | Feb 22, 2021 | Article
View this article as a pdf The RISC-V ISA has seen much adoption thanks to its customizable architecture and open-source business model. Naturally, the open-source ISA is also producing new open-source cores that target certain applications. If you are planning to...
by Team Declaration | Jun 22, 2020 | Article
Launched in 2015 and currently used by about 20% of all VHDL FPGA designers, UVVM is one of the fastest growing verification methodologies in the EDA industry. Espen Tallaksen, CTO & Principal FPGA/ASIC Developer with Bitvis and Sunil Sahoo, Corporate Applications...
by Team Declaration | May 13, 2020 | Article
View this article as a pdf Various forms of malware, including the offspring of the Stuxnet worm that was written to hunt for controller hardware, are tailored to transfer via USB drive. Michael Barrett, MD of Nexus Industrial Memory, recommends the use of industrial...
by Team Declaration | Apr 30, 2020 | Article
View this article as a pdf Wire and ribbon bonders deliver considerable benefits in power pack volume production scenarios. Matt Brown, Director of Inseto, discusses materials, production considerations and bonding machine capabilities. As readers will be aware, a...
