by Team Declaration | Nov 9, 2020 | Case Study
GB Electronics (UK) Ltd (GBE) selects Datakey® RUGGEDrive™ UFX tokens and IP67-rated UR4410IM receptacles for use in harsh environment data logging applications. Environmental monitoring plays an essential role in modern life and data is often acquired in extremely...
by Team Declaration | Oct 26, 2020 | Press Release
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has added PYNQ Python Productivity for Zynq from Xilinx, Inc. to its TySOM family of Xilinx Zynq SoC based boards and its TySOM Embedded Development...
by Team Declaration | Oct 13, 2020 | Press Release
Flexxon Appoints Nexus: Giving Engineers Easy Access to Specialist Memory for Embedded Systems Romsey, Hampshire, United Kingdom – Nexus Industrial Memory has been appointed by Flexxon to distribute its wide range of industrial NAND flash products – which include...
by Team Declaration | Oct 12, 2020 | Press Release
Northampton, United Kingdom – HORIBA, a leading supplier of automotive test systems, has launched an advanced rugged enclosure for its versatile OBS-ONE portable emissions measurement system (PEMS), enabling it to be used for the in-service monitoring of real world...
by Team Declaration | Oct 12, 2020 | Case Study
A K&S IConn ProCu PLUS ball bonder, supplied by Inseto, provides Alter Technology TÜV NORD UK with additional and enhanced manufacturing capabilities, empowers the company to take on new kinds of projects and promises a rapid return on investment. Alter Technology...
